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Final Electrical Specifications
LTC1708-PG Dual Adjustable 5-Bit VID High Efficiency, 2-Phase Current Mode Synchronous Buck Regulator Controller
February 2000
FEATURES
s s s s s s s s s s s s s s s s s
DESCRIPTIO
Out-of-Phase Controllers Reduce Input Capacitance and Power Supply Induced Noise OPTI-LOOPTM Compensation Minimizes COUT Power Good Output Monitors Both Outputs 5-Bit Mobile VID Control, VOUT: 0.9V to 2.0V Dual N-Channel MOSFET Synchronous Drive 1% Output Voltage Accuracy DC Programmed Fixed Frequency 150kHz to 300kHz Wide VIN Range: 3.5V to 36V Operation Very Low Dropout Operation: 99% Duty Cycle Adjustable Soft-Start Current Ramping Foldback Output Current Limiting Latched Short-Circuit Shutdown with Defeat Option Output Overvoltage Protection Remote Output Voltage Sense Low Shutdown Current: 20A 5V and 3.3V Standby Regulators Selectable Constant Frequency, Burst ModeTM and Continuous Operation
The LTC(R)1708 is a dual adjustable 5-bit VID programmable step-down switching regulator controller that drives all N-Channel power MOSFET stages. A constant frequency current mode architecture allows adjustment of the frequency up to 300kHz. Power loss and noise due to the ESR of the input capacitance are minimized by operating the two main controller output stages out of phase. OPTI-LOOP compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values. The precision 0.8V reference is compatible with future microprocessor generations, and a wide 3.5V to 30V (36V maximum) input supply range that encompasses all battery chemistries. A power good output indicates when the output voltages are within 7.5% of their programmed value. A RUN/SS pin for each controller provides both soft-start and an optional timed, short-circuit shutdown. Other protection features include: internal foldback current limiting and an output overvoltage crowbar. The force continuous control pin (FCB) can be used to inhibit Burst Mode operation or to regulate a third, flyback output.
, LTC and LT are registered trademarks of Linear Technology Corporation. Burst Mode and OPTI-LOOP are trademarks of Linear Technology Corporation.
APPLICATIO S
s s
Notebook and Palmtop Computers, PDAs Portable Instruments
TYPICAL APPLICATIO
M1 L1 1H
+
4.7F D3 VIN TG1 CB1 0.47F BOOST1 SW1 D1 M2 5 VID BITS LTC1708-PG BG1 VID0 TO VID4 SENSE1+ RSENSE1 0.003 1000pF SENSE1- ATTNIN COUT1a + 10F 6.3V CERAMIC COUT1 270F 2V SP x4 CC1 1500pF RC1 22k ITH1 CSS1 0.1F BG2 PGND SENSE2 + PGOOD SENSE2 - VOSENSE2 ITH2 CSS2 0.1F CC2 220pF RC2 15k VIDVCC INTVCC TG2 BOOST2 SW2 D4
1F CERAMIC M3a CB2 0.1F
1000pF
VOUT1 0.925V TO 2.00V 14.1A
RUN/SS1 SGND RUN/SS2
Figure 1. High Efficiency VID Controlled, 2-Output Step-Down Converter
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
CIN 10F 50V CERAMIC x4 L2 2.2H M3b D2 RSENSE2 0.01 R3 20k 1% R4 63.4k 1% COUT 180F 4V SP
U
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VIN 4.75V TO 28V
VOUT2 1.5V 4A
+
M1: IRF7811 M2: 1RF7809 M3a, M3b: FDS6982 L1: VISHAY 5050CE ATTNOUT CONNECTED TO EAIN1
1628 F01
1
LTC1708-PG
ABSOLUTE
(Note 1)
AXI U RATI GS
PACKAGE/ORDER I FOR ATIO
TOP VIEW RUN/SS1 SENSE1 + SENSE1 - EAIN1 FREQSET STBYMD FCB ITH1 SGND 1 2 3 4 5 6 7 8 9 36 PGOOD 35 TG1 34 SW1 33 BOOST1 32 VIN 31 BG1 30 EXTVCC 29 INTVCC 28 PGND 27 BG2 26 BOOST2 25 SW2 24 TG2 23 RUN/SS2 22 VIDVCC 21 VID4 20 VID3 19 VID2
Input Supply Voltage (VIN).........................36V to - 0.3V Topside Driver Voltages (BOOST1, BOOST2) ...................................42V to - 0.3V Switch Voltage (SW1, SW2) .........................36V to - 5V INTVCC, EXTVCC, RUN/SS1, RUN/SS2, (BOOST1-SW1), (BOOST2-SW2), ...............7V to - 0.3V SENSE1+, SENSE2 +, SENSE1-, SENSE2 - Voltages ....................... (1.1)INTVCC to - 0.3V FREQSET, STBYMD, FCB, VIDVCC, VID0-4, PGOOD Voltages ..........................................7V to - 0.3V ITH1, ITH2, EAIN1, EAIN2, ATTNIN, ATTNOUT Voltages ...................................2.7V to - 0.3V Peak Output Current <10s (TG1, TG2, BG1, BG2) ... 3A INTVCC Peak Output Current ................................ 50mA Operating Ambient Temperature Range (Note 2) ...................................................-40C to 85C Junction Temperature (Note 3) ............................. 125C Storage Temperature Range ................. - 65C to 150C Lead Temperature (Soldering, 10 sec).................. 300C
ORDER PART NUMBER LTC1708EG-PG
3.3VOUT 10 ITH2 11 EAIN2 12 SENSE2 - 13 SENSE2 + 14 ATTNOUT 15 ATTNIN 16 VID0 17 VID1 18
G PACKAGE 36-LEAD PLASTIC SSOP
TJMAX = 125C, JA = 85C/W
Consult factory for Industrial and Military grade parts.
ELECTRICAL CHARACTERISTICS
SYMBOL VEAIN1, 2 IEAIN1, 2 VREFLNREG VLOADREG PARAMETER Regulated Feedback Voltage at EAIN Pin Feedback Current Reference Voltage Line Regulation Output Voltage Load Regulation Main Control Loops
The q denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 15V, VRUN/SS1, 2 = 5V unless otherwise noted.
CONDITIONS (Note 4); ITH1, 2 Voltage = 1.2V (Note 4) VIN = 3.6V to 30V (Note 4) (Note 4) Measured in Servo Loop; ITH1, 2 Voltage = 1.2V to 0.7V q Measured in Servo Loop; ITH1, 2 Voltage = 1.2V to 2.0V q ITH1, 2 = 1.2V; Sink/Source 5A; (Note 4) ITH1, 2 = 1.2V; (gm * ZL, No Ext Load) (Note 4) (Note 5) EXTVCC Tied to GND; VID Inputs Open Circuit VRUN/SS1, 2 = 0V, VSTBYMD > 2V VRUN/SS1, 2 = 0V, VSTBYMD = Open
q q
MIN 0.792
TYP 0.800 -5 0.002 0.1 - 0.1 1.3 3 850 125 20
MAX 0.808 - 50 0.02 0.5 - 0.5
UNITS V nA %/V % % mmho MHz A A A V A V V
gm1, 2 gmOL1, 2 IQ
Transconductance Amplifier gm Transconductance Amplifier GBW Input DC Supply Current Normal Mode Standby Shutdown Forced Continuous Threshold Forced Continuous Current Burst Inhibit Threshold Undervoltage Lockout
35 0.840 - 0.1 4.8 4
VFCB IFCB VBINHIBIT UVLO
0.760 - 0.3
0.800 - 0.18 4.3 3.5
VFCB = 0.85V Measured at FCB pin VIN Ramping Down
2
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W
U
U
WW
W
LTC1708-PG
ELECTRICAL CHARACTERISTICS
SYMBOL VOV ISENSE VSTBYMD MS VSTBYMD KA DFMAX IRUN/SS1, 2 VRUN/SS1, 2 LT ISCL1, 2 ISDLHO VSENSE(MAX) PARAMETER Output Overvoltage Threshold Sense Pins Total Source Current Master Shutdown Threshold Keep-Alive Power On-Threshold Maximum Duty Factor Soft-Start Charge Current RUN/SS Pin Latchoff Threshold RUN/SS Discharge Current Shutdown Latch Disable Current Maximum Current Sense Threshold TG Transition Time: Rise Time Fall Time BG Transition Time: Rise Time Fall Time Top Gate Off to Bottom Gate On Delay Synchronous Switch-On Delay Time Bottom Gate Off to Top Gate On Delay Top Switch-On Delay Time Minimum On-Time Internal VCC Voltage INTVCC Load Regulation EXTVCC Voltage Drop EXTVCC Switchover Voltage EXTVCC Hysteresis Oscillator Frequency Lowest Frequency Highest Frequency FREQSET Input Current 3.3V Regulator Output Voltage 3.3V Regulator Load Regulation 3.3V Regulator Line Regulation PGOOD Voltage Low PGOOD Leakage Current PGOOD Trip Level VFREQSET = Open (Note 7) VFREQSET = 0V VFREQSET = 2.4V VFREQSET = 0V No Load I3.3 = 0 to 10mA 6V < VIN < 30V IPGOOD = 2mA VPGOOD = 5V Relative to the 0.8V Regulated Feedback Voltage EAIN1, 2 Ramping Negative from 0.8V EAIN1, 2 Ramping Positive from 0.8V - 10 5 - 7.5 7.5
q
The q denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 15V, VRUN/SS1, 2 = 5V unless otherwise noted.
CONDITIONS Measured at EAIN1, 2 (Each Channel); VSENSE1-, 2 - = VSENSE1+, 2+ = 0V VSTBYMD Ramping Down VSTBYMD Ramping Up, RUNSS1, 2 = 0V In Dropout VRUN/SS1, 2 = 1.9V VRUN/SS1, VRUN/SS2 Rising VRUN/SS1, VRUN/SS2 Rising from 3V Soft Short Condition EAIN1, 2 = 0.5V; VRUN/SS1, 2 = 4.5V EAIN1, 2 = 0.5V VEAIN1, 2 = 0.7V; VSENSE1, 2 = 5V VEAIN1, 2 = 0.7V; VSENSE1, 2 = 5V CLOAD = 3300pF (Note 10) CLOAD = 3300pF (Note 10) CLOAD = 3300pF (Note 10) CLOAD = 3300pF (Note 10) CLOAD = 3300pF Each Driver (Note 10) CLOAD = 3300pF Each Driver (Note 10) Tested with a Square Wave (Notes 6, 10) 6V < VIN < 30V, VEXTVCC = 4V ICC = 0 to 20mA, VEXTVCC = 4V ICC = 20mA, VEXTVCC = 5V ICC = 20mA, EXTVCC Ramping Positive
q q
MIN 0.84 - 85 0.4 98 0.5 1.0 0.5
TYP 0.86 - 60 0.6 1.5 99.4 1.2 1.5 4.1 2 1.6
MAX 0.88
UNITS V A V
2
V % A
VRUN/SS1, 2 ON RUN/SS Pin ON Threshold
1.9 4.5 4 5 85 88 90 90 90 80
V V A A mV mV ns ns ns ns ns ns
65 62
75 75 50 50 40 40 90 90 160
TG1, 2 tr TG1, 2 tf BG1, 2 tr BG1, 2 tf TG/BG t1D BG/TG t2D tON(MIN) VINTVCC VLDO INT VLDO EXT VEXTVCC VLDOHYS Oscillator fOSC fLOW fHIGH IFREQSET V3.3OUT V3.3IL V3.3VL PGOOD Output VPGL IPGOOD VPG
200 5.2 1.0 240
ns V % mV V V
INTVCC Linear Regulator 4.8 5.0 0.2 120 4.5 4.7 0.2 190 120 280 220 140 310 -2 3.25 3.35 0.5 0.05 0.1 250 170 350 -1 3.45 2 0.2 0.3 1 -5 10
kHz kHz kHz A V % % V A % %
3.3V Linear Regulator
3
LTC1708-PG
ELECTRICAL CHARACTERISTICS
SYMBOL VID Parameters VIDVCC IVIDVCC RFBOUT1/SENSE1 RRATIO RPULL-UP VIDT IVIDLEAK VPULL-UP VID Operating Supply Voltage VID Supply Current Resistance Between ATTNIN/ATTNOUT Resistor Ratio Accuracy VID0 to VID4 Pull-Up Resistance VID Voltage Threshold VID Input Leakage Current VID Pull-Up Voltage (Note 9) VIDVCC < VIDVCC < 7V VIDVCC = 3V 2.5 Programmed from 0.925V to 2.00V (Note 9) VDIODE = 0.7V 0.4 VIDVCC = 3.3V (Note 8) 2.7 0.01 10 0.25 40 1.0 0.1 2.8 1.6 1 3.1 5.5 5 5 V A k % k V A V PARAMETER
The q denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. VIN = 15V, VRUN/SS1, 2 = 5V unless otherwise noted.
CONDITIONS MIN TYP MAX UNITS
Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: The LTC1708EG-PG is guaranteed to meet performance specifications from 0C to 70C. Specifications over the - 40C to 85C operating temperature range are assured by design, characterization and correlation with statistical process controls. Note 3: TJ is calculated from the ambient temperature TA and power dissipation PD according to the following formulas: LTC1708EG-PG: TJ = TA + (PD * 85C/W) Note 4: The LTC1708-PG is tested in a feedback loop that servos VITH1, 2 to a specified voltage and measures the resultant EAIN1, 2. Note 5: The supply current is higher due to the gate charge being delivered at the switching frequency. See Applications Information.
Note 6: The minimum on-time condition corresponds to the on inductor peak-to-peak ripple current 40% of IMAX (see minimum on-time considerations in the Applications Information section). Note 7: VFREQSET pin internally tied to 1.19V reference through a large resistance. Note 8: With all five VID inputs floating (or tied to VIDVCC) the VIDVCC current is typically < 1A. However, the VIDVCC current will rise and be approximately equal to the number of grounded VID input pins times (VIDVCC - 0.6V)/40k. (See the Applications Information section.) Note 9: Each built-in pull-up resistor attached to the VID inputs also has a series diode to allow input voltages higher than the VIDVCC supply without damage or clamping. (See Applications Information section.) Note 10: Rise and fall times are measured at 20% to 80% levels. Delay and nonoverlap times are measured using 50% levels.
TYPICAL PERFOR A CE CHARACTERISTICS
Efficiency vs Output Current and Mode (Figure 12)
100 90 80 EFFICIENCY (%) 70 60 50 40 30 20 10 0 0.1 VIN = 15V VOUT = 1.6V 10 1 OUTPUT CURRENT (A) 100
1708 G01
Burst Mode OPERATION
15A EFFICIENCY (%)
60 50 40 30 20 10 0 0.01
EFFICIENCY (%)
CONSTANT FREQUENCY MODE PWM MODE
4
UW
Efficiency vs Output Current (Figure 12)
100 90 80 70 VIN = 10V VIN = 15V VIN = 20V EXTVCC = 0V VIN = 5V 15A 100
Efficiency vs Input Voltage (Figure 12)
VOUT = 1.6V EXTVCC = 0V IOUT = 7A
90
80
IOUT = 12A
70
60 VFCB = OPEN VOUT = 1.6V 1 0.1 10 OUTPUT CURRENT (A) 100
1708 G02
50
5
10
15 20 INPUT VOLTAGE (V)
25
28
1708 G03
LTC1708-PG TYPICAL PERFOR A CE CHARACTERISTICS
Supply Current vs Input Voltage and Mode (Figure 12)
1000 250
INTVCC AND EXTVCC SWITCH VOLTAGE (V)
800
EXTVCC VOLTAGE DROP (mV)
SUPPLY CURRENT (A)
600 BOTH CONTROLLERS ON 400
200
STANDBY SHUTDOWN
0 0 5 20 15 10 25 INPUT VOLTAGE (V) 30 35
Internal 5V LDO Line Reg
5.1 5.0
INTVCC VOLTAGE (V)
75
ILOAD = 1mA
4.9 4.8 4.7 4.6 4.5 4.4 0 5 20 15 25 10 INPUT VOLTAGE (V) 30 35
VSENSE (mV)
VSENSE (mV)
Maximum Current Sense Threshold vs VRUN/SS (Soft-Start)
80 VSENSE(CM) = 1.6V
60 VSENSE (mV)
VSENSE (mV)
72
VSENSE (mV)
40
20
0 0 1 2 3 VRUN/SS (V)
1708 G10
4
UW
1708 G04
EXTVCC Voltage Drop
5.05 5.00 4.95 4.90 4.85 4.80 4.75
INTVCC and EXTVCC Switch Voltage vs Temperature
INTVCC VOLTAGE
200
150
100
50
EXTVCC SWITCHOVER THRESHOLD
0
0
10
30 20 CURRENT (mA)
40
50
1708 G05
4.70 - 50 - 25
50 25 75 0 TEMPERATURE (C)
100
125
1708 G06
Maximum Current Sense Threshold vs Duty Factor
80 70 60
Maximum Current Sense Threshold vs Percent of Nominal Output Voltage (Foldback)
50
50 40 30 20 10
25
0 0 20 40 60 DUTY FACTOR (%) 80 100
1708 G08
0
50 100 0 25 75 PERCENT ON NOMINAL OUTPUT VOLTAGE (%)
1708 G09
1708 G07
Maximum Current Sense Threshold vs Sense Common Mode Voltage
80 90 80 76 70 60 50 40 30 20 10 0 64 -10 -20 -30
Current Sense Threshold vs ITH Voltage
68
5
6
60
0
1 3 4 2 COMMON MODE VOLTAGE (V)
5
1708 G11
0
0.5
1
1.5 VITH (V)
2
2.5
1708 G12
5
LTC1708-PG TYPICAL PERFOR A CE CHARACTERISTICS
Load Regulation
0.0
NORMALIZED VOUT (%)
-0.1
-0.2
VITH (V)
1.5
ISENSE (A)
-0.3
-0.4
0
1
3 2 LOAD CURRENT (A)
Maximum Current Sense Threshold vs Temperature
80
78 DROPOUT VOLTAGE (V)
RUN/SS CURRENT (A)
VSENSE (mV)
76
74
72
70 -50 -25
50 25 0 75 TEMPERATURE (C)
Load Step (Figure 12)
VOUT 100mV/DIV
IOUT 5A/DIV
10s/DIV 1708 G22 VIN = 15V VOUT2 = 1.6V LOAD STEP = 100mA - 15A CONSTANT FREQUENCY MODE: VFCB = VINTVCC ACTIVE VOLTAGE POSITIONING CIRCUIT
6
UW
FCB = 0V VIN = 15V FIGURE 1 VOUT2 4
1708 G13
VITH vs VRUN/SS
2.5 VEAIN = 0.7V
100
SENSE Pins Total Source Current
2.0
50
0
1.0
-50
0.5
0
5
0
1
2
3 VRUN/SS (V)
4
5
6
1708 G14
-100
0
2
4
6
1708 G15
VSENSE COMMON MODE VOLTAGE (V)
Dropout Voltage vs Output Current
4 VOUT = 5V
RUN/SS Current vs Temperature
1.8 1.6
3
1.4 1.2 1.0 0.8 0.6 0.4 0.2
2 RSENSE = 0.015 1 RSENSE = 0.010 0
100
125
0
0.5
1.0 1.5 2.0 2.5 3.0 OUTPUT CURRENT (A)
3.5
4.0
0 -50
-25
0 25 50 75 TEMPERATURE (C)
100
125
1708 G17
1708 G18
1708 G25
Load Step (Figure 12)
Load Step (Figure 12)
VOUT 100mV/DIV
VOUT 100mV/DIV
IOUT 5A/DIV
IOUT 5A/DIV
VIN = 15V 10s/DIV VOUT2 = 1.6V LOAD STEP = 100mA - 15A Burst Mode OPERATION: VFCB = OPEN ACTIVE VOLTAGE POSITIONING CIRCUIT
1708 G20
VIN = 15V 10s/DIV VOUT2 = 1.6V LOAD STEP = 100mA - 15A CONTINUOUS MODE: VFCB = 0V ACTIVE VOLTAGE POSITIONING CIRCUIT
1708 G21
LTC1708-PG TYPICAL PERFOR A CE CHARACTERISTICS
Soft-Start Up (Figure 12)
VRUN/SS 2V/DIV VOUT 1V/DIV VOUT 20mV/DIV
IOUT 5A/DIV
VIN = 15V VOUT2 = 1.6V
100ms/DIV
Current Sense Input Current vs Temperature
35 10
EXTVCC SWITCH RESISTANCE ()
CURRENT SENSE INPUT CURRENT (A)
33
FREQUENCY (kHz)
31
29
27
25 -50 -25
50 25 0 75 TEMPERATURE (C)
Undervoltage Lockout vs Temperature
3.50 3.45 3.40 3.35 3.30 3.25 3.20 -50 -25 4.5
SHUTDOWN LATCH THRESHOLDS (V)
UNDERVOLTAGE LOCKOUT (V)
UW
1708 G19
Burst Mode Operation (Figure 12)
VOUT 20mV/DIV
Constant Frequency (Burst Inhibit) Operation (Figure 12)
IOUT 5A/DIV
IOUT 2A/DIV VIN = 15V VOUT2 = 1.6V VFCB = OPEN IOUT = 250mA 20s/DIV VIN = 15V VOUT2 = 1.6V VFCB = VINTVCC IOUT = 250mA 20s/DIV
1708 G23
1708 G24
EXTVCC Switch Resistance vs Temperature
350 300 250
Oscillator Frequency vs Temperature
VFREQSET = 5V
8
6
VFREQSET = OPEN 200 150 100 50 VFREQSET = 0V
4
2
100
125
0 -50 -25
50 25 0 75 TEMPERATURE (C)
100
125
0 - 50 - 25
50 25 75 0 TEMPERATURE (C)
100
125
1708 G26
1708 G27
1708 G28
Shutdown Latch Thresholds vs Temperature
4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 -50 -25 0 25 50 75 TEMPERATURE (C) 100 125 LATCHOFF THRESHOLD LATCH ARMING
50 25 75 0 TEMPERATURE (C)
100
125
1708 G29
1708 G30
7
LTC1708-PG
PI FU CTIO S
RUN/SS1, RUN/SS2 (Pins 1, 23): Combination of softstart, run control inputs and short-circuit detection timers. A capacitor to ground at each of these pins sets the ramp time to full output current. Forcing either of these pins back below 1.0V causes the IC to shut down the circuitry required for that particular controller. Latchoff overvoltage protection is also invoked via this pin as described in the Applications Information section. SENSE1+, SENSE2+ (Pins 2, 14): The (+) Input to the Differential Current Comparators. The Ith pin voltage and built-in offsets between the SENSE- and SENSE+ pins in conjunction with RSENSE sets the current trip threshold. SENSE1-, SENSE2- (Pins 3, 13): The (-) Input to the Differential Current Comparators. EAIN1, EAIN2 (Pins 4, 12): Receives the remotely sensed feedback voltage for each controller from a resistive divider across the output. The VID section may be used for one resistive divider. FREQSET (Pin 5): Frequency Control Input to the Oscillator. This pin can be left open, tied to ground, tied to INTVCC or driven by an external voltage source. This pin can also be used with an external phase detector to build a true phase-locked loop. STBYMD (Pin 6): Control pin that determines which circuitry remains active when the controllers are shut down and/or provides a common control point to shut down both controllers. See the Operation section for details. FCB (Pin 7): Forced Continuous Control Input. This input acts on both controllers and is normally used to regulate a secondary winding using a resistive divider. An applied input voltage below 0.8V will force continuous synchronous operation on both controllers. Do not leave this pin floating. ITH1, ITH2 (Pins 8, 11): Error Amplifier Output and Switching Regulator Compensation Point. Each associated channels' current comparator trip point increases with this control voltage. SGND (Pin 9): Small-Signal Ground. Common to both controllers, this pin must be routed separately from high current grounds to the common (-) terminals of the COUT capacitors. 3.3VOUT (Pin 10): Output of a linear regulator capable of supplying 10mA DC with peak currents as high as 50mA. ATTNOUT (Pin 15): Divided down output voltage feeding the EAIN pin of the regulator. The VID inputs program a resistive divider between ATTNIN and SGND. ATTNOUT is the tap point on the divider. The voltage on ATTNOUT is 0.8V when the output is in regulation. This pin can be bypassed to SGND with 50pF. ATTNIN (Pin 16): Receives the remotely sensed feedback voltage from the output. VID0 to VID4 (Pins 17 to 21): Digital inputs for controlling the output voltage from 0.925V to 2.0V. Table 1 specifies the output voltage for the 32 combinations of digital inputs. The LSB (VID0) represents 50mV increments in the upper voltage range (2.00V to 1.30V) and 25mV increments in the lower voltage range (1.275V to 0.925V). Logic Low = GND, Logic High = VIDVCC or Float. VIDVCC (Pin 22): VID Input Supply Voltage. Range from 2.7V to 5.5V. Typically this pin is tied to INTVCC. PGND (Pin 28): Driver Power Ground. Connects to the sources of bottom (synchronous) N-channel MOSFETs, anode of the Schottky rectifier and the (-) terminal(s) of CIN. INTVCC (Pin 29): Output of the Internal 5V Linear Low Dropout Regulator and the EXTVCC Switch. The driver and control circuits are powered from this voltage source. Must be decoupled to power ground with a minimum of 4.7F tantalum or other low ESR capacitor. The INTVCC regulator standby function is determined by the STBYMD pin. EXTVCC (Pin 30): External Power Input to an Internal Switch Connected to INTVCC. This switch closes and supplies VCC power, bypassing the internal low dropout regulator, whenever EXTVCC is higher than 4.7V. See EXTVCC connection in Applications Information section. Do not exceed 7V on this pin. BG1, BG2 (Pins 31, 27): High Current Gate Drives for Bottom (Synchronous) N-Channel MOSFETs. Voltage swing at these pins is from ground to INTVCC. VIN (Pin 32): Main Supply Pin. A bypass capacitor should be tied between this pin and the signal ground pin.
8
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LTC1708-PG
PI FU CTIO S
BOOST1, BOOST2 (Pins 33, 26): Bootstrapped Supplies to the Topside Floating Drivers. Capacitors are connected between the boost and switch pins and Schottky diodes are tied between the boost and INTVCC pins. Voltage swing at the boost pins is from INTVCC to (VIN + INTVCC). SW1, SW2 (Pins 34, 25): Switch Node Connections to Inductors. Voltage swing at these pins is from a Schottky diode (external) voltage drop below ground to VIN. TG1, TG2 (Pins 35, 24): High Current Gate Drives for Top N-Channel MOSFETs. These are the outputs of floating drivers with a voltage swing equal to INTVCC - 0.5V superimposed on the switch node voltage SW. PGOOD (Pin 36): Open-Drain Logic Output. PGOOD is pulled to ground when the voltage at either EAIN pin is not within 7.5% of the setpoint.
FU CTIO AL DIAGRA
FREQSET 1M 1.19V CLK1 OSCILLATOR CLK2 - PGOOD + VFB1 - + - + VFB2 - VSEC 0.17A FCB + - 3.3VOUT + - VIN VIN 4.8V EXTVCC INTVCC + - 5V LDO REG 0.8V FCB VREF 4.5V - + BINH + 0.74V 0.74V 0.86V
0.86V
- 0.86V 4(VFB) SLOPE COMP
+
+ 30k SENSE - 30k SENSE
DSEC
3mV
45k 2.4V
45k VFB 0.800V EAIN
- EA + OV 1.2A + -
+
5V
0.860V ITH
CC
SGND
INTERNAL SUPPLY 6V
STBYMD
SHDN RST 4(VFB)
RUN SOFTSTART RUN/SS
CC2 RC
ATTNIN CSS ATTNOUT R1 VARIABLE R2 10k 5-BIT VID DECODER 40k EACH VID INPUT
VID0 VID1 VID2 VID3 VID4
VIDVCC
1708 F02
Figure 2
+
W
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INTVCC DUPLICATE FOR SECOND CONTROLLER CHANNEL DROP OUT DET S R Q Q TOP BOT FCB SW SWITCH LOGIC BOT INTVCC BG PGND 0.6V + - SHDN BOOST DB CB
VIN
TG
+
D1 CIN
TOP ON
COUT
+
RSENSE INTVCC CSEC
VOUT
I1
+
-
++
-
-
I2
9
LTC1708-PG
OPERATIO
Main Control Loop The LTC1708 uses a constant frequency, current mode step-down architecture with the two controller channels operating 180 degrees out of phase. During normal operation, each top MOSFET is turned on when the clock for that channel sets the RS latch, and turned off when the main current comparator, I1, resets the RS latch. The peak inductor current at which I1 resets the RS latch is controlled by the voltage on the ITH pin, which is the output of each error amplifier EA. The EAIN pin receives the voltage feedback signal, which is compared to the internal reference voltage by the EA. When the load current increases, it causes a slight decrease in EAIN relative to the 0.8V reference, which in turn causes the ITH voltage to increase until the average inductor current matches the new load current. After the top MOSFET has turned off, the bottom MOSFET is turned on until either the inductor current starts to reverse, as indicated by current comparator I2, or the beginning of the next cycle. The top MOSFET drivers are biased from floating bootstrap capacitor CB, which normally is recharged during each off cycle through an external diode when the top MOSFET turns off. As VIN decreases to a voltage close to VOUT, the loop may enter dropout and attempt to turn on the top MOSFET continuously. The dropout detector detects this and forces the top MOSFET off for about 500ns every tenth cycle to allow CB to recharge. The main control loop is shut down by pulling the RUN/SS pin low. Releasing RUN/SS allows an internal 1.2A current source to charge soft-start capacitor CSS. When CSS reaches 1.5V, the main control loop is enabled with the ITH voltage clamped at approximately 30% of its maximum value. As CSS continues to charge, the ITH pin voltage is gradually released allowing normal, full-current operation. When both RUN/SS1 and RUN/SS2 are low, all LTC1708 controller functions are shut down, and the STBYMD pin determines if the standby 5V and 3.3V regulators are kept alive. Low Current Operation The FCB pin is a multifunction pin providing two functions: 1) to provide regulation for a secondary winding by temporarily forcing continuous PWM operation on
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(Refer to Functional Diagram)
controller 1 and 2) select between two modes of low current operation. When the FCB pin voltage is below 0.8V, the controller forces continuous PWM current mode operation. In this mode, the top and bottom MOSFETs are alternately turned on to maintain the output voltage independent of direction of inductor current. When the FCB pin is below VINTVCC - 2V but greater than 0.8V, the controller enters Burst Mode operation. Burst Mode operation sets a minimum output current level before inhibiting the top switch and turns off the synchronous MOSFET(s) when the inductor current goes negative. This combination of requirements will, at low currents, force the ITH pin below a voltage threshold that will temporarily inhibit turn-on of both output MOSFETs until the output voltage drops. There is 60mV of hysteresis in the burst comparator B tied to the ITH pin. This hysteresis produces output signals to the MOSFETs that turn them on for several cycles, followed by a variable "sleep" interval depending upon the load current. The resultant output voltage ripple is held to a very small value by having the hysteretic comparator after the error amplifier gain block. Constant Frequency Operation When the FCB pin is tied to INTVCC, Burst Mode operation is disabled and the forced minimum output current requirement is removed. This provides constant frequency, discontinuous (preventing reverse inductor current) current operation over the widest possible output current range. This constant frequency operation is not as efficient as Burst Mode operation, but does provide a lower noise, constant frequency operating mode down to approximately 1% of designed maximum output current. Continuous Current (PWM) Operation Tying the FCB pin to ground will force continuous current operation. This is the least efficient operating mode, but may be desirable in certain applications. The output can source or sink current in this mode. When sinking current while in forced continuous operation, current will be forced back into the main power supply potentially boosting the input supply to dangerous voltage levels-- BEWARE!
LTC1708-PG
OPERATIO
Frequency Setting The FREQSET pin provides frequency adjustment of the internal oscillator from approximately 140kHz to 310kHz. This input is nominally biased through an internal resistor to the 1.19V reference, setting the oscillator frequency to approximately 220kHz. This pin can be driven from an external AC or DC signal source to control the instantaneous frequency of the oscillator. INTVCC/EXTVCC Power Power for the top and bottom MOSFET drivers and most other internal circuitry is derived from the INTVCC pin. When the EXTVCC pin is left open, an internal 5V low dropout linear regulator supplies INTVCC power. If EXTVCC is taken above 4.7V, the 5V regulator is turned off and an internal switch is turned on connecting EXTVCC to INTVCC. This allows the INTVCC power to be derived from a high efficiency external source such as the output of the regulator itself or a secondary winding, as described in the Applications Information. Standby Mode Pin The STBYMD pin is a three-state input that controls common circuitry within the IC as follows: When the STBYMD pin is held at ground, both controller RUN/SS pins are pulled to ground providing a single control pin to shut down both controllers. When the pin is left open, the internal RUN/SS currents are enabled to charge the RUN/SS capacitor(s), allowing the turn-on of either controller and activating necessary common internal biasing. When the STBYMD pin is taken above 2V, both internal linear regulators are turned on independent of the state on the RUN/SS pins of the two switching regulator controllers, providing an output power source for "wake-up" circuitry. Decouple the pin with a small capacitor (0.01F) to ground if the pin is not connected to a DC potential. Output Overvoltage Protection An overvoltage comparator, OV, guards against transient overshoots (>7.5%) as well as other more serious conditions that may overvoltage the output. In this case, the top MOSFET is turned off and the bottom MOSFET is turned on until the overvoltage condition is cleared.
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(Refer to Functional Diagram)
VID Control Logic inputs VID0 to VID4 program an internal resistive divider. The output voltage can be programmed in 50mV and 25mV increments from 0.925V to 2.0V (see Table 1). These logic input pins are internally pulled up to the VIDVCC pin using separate internal series resistor/diode paths. The diodes provide electrical isolation when the logic pins are externally pulled up to a higher voltage supply than VIDVCC. Power Good (PGOOD) The PGOOD pin is connected to an open drain of an internal MOSFET. The MOSFET turns on when the outputs are not both within 7.5% of their nominal output levels as determined by their feedback dividers. When both outputs are within 7.5% of their nominal values, the MOSFET is turned off within 10s and the pin is pulled up by an external source Foldback Current, Short-Circuit Detection and Short-Circuit Latchoff The RUN/SS capacitors are used initially to limit the inrush current of each switching regulator. After the controller has been started and been given adequate time to charge up the output capacitors and provide full load current, the RUN/SS capacitor is used in a short-circuit time-out circuit. If the output voltage falls to less than 70% of its nominal output voltage, the RUN/SS capacitor begins discharging on the assumption that the output is in an overcurrent and/or short-circuit condition. If the condition lasts for a long enough period as determined by the size of the RUN/SS capacitor, both controllers will be shut down until the RUN/SS pin's voltages are recycled. This built-in latchoff can be overridden by providing a >5A pull-up at a compliance of 5V to the RUN/SS pin(s). This current shortens the soft-start period but also prevents net discharge of the RUN/SS capacitor(s) during an overcurrent and/or short-circuit condition. Foldback current limiting is also activated when the output voltage falls below 70% of its nominal level whether or not the short-circuit latchoff circuit is enabled. Even if a short is present and the shortcircuit latchoff is not enabled, a safe, low output current is provided due to internal current foldback and actual power
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LTC1708-PG
OPERATIO
wasted is low due to the efficient nature of the current mode switching regulator. THEORY AND BENEFITS OF 2-PHASE OPERATION The LTC1708 dual high efficiency DC/DC controller, like the LTC1628, brings the considerable benefits of 2-phase operation to portable applications for the first time. Notebook computers, PDAs, handheld terminals and automotive electronics will all benefit from the lower input filtering requirement, reduced electromagnetic interference (EMI) and increased efficiency associated with 2-phase operation. Why the need for 2-phase operation? Up until the LTC1628, constant-frequency dual switching regulators operated both channels in phase (i.e., single-phase operation). This means that both switches turned on at the same time, causing current pulses of up to twice the amplitude of those for one regulator to be drawn from the input capacitor and battery. These large amplitude current pulses increased the total RMS current flowing from the input capacitor, requiring the use of more expensive input capacitors and increasing both EMI and losses in the input capacitor and battery. With 2-phase operation, the two channels of the dualswitching regulator are operated 180 degrees out of phase. This effectively interleaves the current pulses drawn by the switches, greatly reducing the overlap time where they add together. The result is a significant reduction in total RMS input current, which in turn allows less
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(Refer to Functional Diagram)
expensive input capacitors to be used, reduces shielding requirements for EMI and improves real world operating efficiency.
Figure 3 compares the input waveforms for a representative single-phase dual switching regulator to the new LTC1628 2-phase dual switching regulator. An actual measurement of the RMS input current under these conditions shows that 2-phase operation dropped the input current from 2.53ARMS to 1.55ARMS. While this is an impressive reduction in itself, remember that the power losses are proportional to IRMS2, meaning that the actual power wasted is reduced by a factor of 2.66. The reduced input ripple voltage also means less power is lost in the input power path, which could include batteries, switches, trace/connector resistances and protection circuitry. Improvements in both conducted and radiated EMI also directly accrue as a result of the reduced RMS input current and voltage. Of course, the improvement afforded by 2-phase operation is a function of the dual switching regulator's relative duty cycles which, in turn, are dependent upon the input voltage VIN (Duty Cycle = VOUT/VIN). Figure 4 shows how the RMS input current varies for single-phase and 2-phase operation for 3.3V and 5V regulators over a wide input voltage range. It can readily be seen that the advantages of 2-phase operation are not just limited to a narrow operating range, but in fact extend over a wide region. A good rule of thumb
5V SWITCH 20V/DIV 3.3V SWITCH 20V/DIV INPUT CURRENT 5A/DIV INPUT VOLTAGE 500mV/DIV
IIN(MEAS) = 2.53ARMS
DC236 F03a
IIN(MEAS) = 1.55ARMS
DC236 F03b
(a)
(b)
Figure 3. Input Waveforms Comparing Single-Phase (a) and 2-Phase (b) Operation for Dual Switching Regulators Converting 12V to 5V and 3.3V at 3A Each. The Reduced Input Ripple with the LTC1628 2-Phase Regulator Allows Less Expensive Input Capacitors, Reduces Shielding Requirements for EMI and Improves Efficiency
LTC1708-PG
OPERATIO
for most applications is that 2-phase operation will reduce the input capacitor requirement to that for just one channel operating at maximum current and 50% duty cycle. A final question: If 2-phase operation offers such an advantage over single-phase operation for dual switching regulators, why hasn't it been done before? The answer is that, while simple in concept, it is hard to implement. Constant-frequency current mode switching regulators require an oscillator derived "slope compensation" signal to allow stable operation of each regulator at over 50% duty cycle. This signal is relatively easy to derive in singlephase dual switching regulators, but required the development of a new and proprietary technique to allow 2-phase operation. In addition, isolation between the two channels becomes more critical with 2-phase operation because switch transitions in one channel could potentially disrupt the operation of the other channel.
INPUT RMS CURRENT (A)
APPLICATIO S I FOR ATIO
Figure 1 on the first page is a basic LTC1708 application circuit. External component selection is driven by the load requirement, and begins with the selection of RSENSE. Once RSENSE is known, L can be chosen. Next, the power MOSFETs and D1 are selected. Finally, CIN and COUT are selected . The circuit shown in Figure 1 can be configured for operation up to an input voltage of 28V (limited by the external MOSFETs). RSENSE Selection For Output Current RSENSE is chosen based on the required output current. The LTC1708 current comparator has a maximum threshold of 75mV/RSENSE and an input common mode range of SGND to 1.1(INTVCC). The current comparator threshold sets the peak of the inductor current, yielding a maximum average output current IMAX equal to the peak value less half the peak-to-peak ripple current, IL. Allowing a margin for variations in the LTC1708 and external component values yields: RSENSE = 50mV IMAX
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(Refer to Functional Diagram)
The LTC1708 is proof that these hurdles have been surmounted. The new device offers unique advantages for the ever-expanding number of high efficiency power supplies required in portable electronics.
15.0 12.5 10.0 7.5 5.0 2.5 0 2-PHASE DUAL CONTROLLER SINGLE PHASE DUAL CONTROLLER
VO1 = 5V/15A VO2 = 3.3V/15A 0 10 20 30 INPUT VOLTAGE (V) 40
1708 F04
Figure 4. RMS Input Current Comparison
When using the controller in very low dropout conditions, the maximum output current level will be reduced due to the internal compensation required to meet stability criterion for buck regulators operating at greater than 50% duty factor. A curve is provided to estimate this reducton in peak output current level depending upon the operating duty factor. Selection of Operating Frequency The LTC1708 uses a constant frequency architecture with the frequency determined by an internal oscillator capacitor. This internal capacitor is charged by a fixed current plus an additional current that is proportional to the voltage applied to the FREQSET pin. A graph for the voltage applied to the FREQSET pin vs frequency is given in Figure 5. As the operating frequency is increased the gate charge losses will be higher, reducing efficiency (see Efficiency Considerations). The maximum switching frequency is approximately 310kHz.
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2.5 FREQSET PIN VOLTAGE (V) 2.0
1.5
1.0
0.5
0 120
170 220 270 OPERATING FREQUENCY (kHz)
320
1708 F05
Figure 5. FREQSET Pin Voltage vs Frequency
Inductor Value Calculation The operating frequency and inductor selection are interrelated in that higher operating frequencies allow the use of smaller inductor and capacitor values. So why would anyone ever choose to operate at lower frequencies with larger components? The answer is efficiency. A higher frequency generally results in lower efficiency because of MOSFET gate charge losses. In addition to this basic trade-off, the effect of inductor value on ripple current and low current operation must also be considered. The inductor value has a direct effect on ripple current. The inductor ripple current IL decreases with higher inductance or frequency and increases with higher VIN:
IL = V 1 VOUT 1 - OUT ( f)(L) VIN
Accepting larger values of IL allows the use of low inductances, but results in higher output voltage ripple and greater core losses. A reasonable starting point for setting ripple current is IL=0.3(IMAX). Remember, the maximum IL occurs at the maximum input voltage. The inductor value also has secondary effects. The transition to Burst Mode operation begins when the average inductor current required results in a peak current below 25% of the current limit determined by RSENSE. Lower inductor values (higher IL) will cause this to occur at lower load currents, which can cause a dip in efficiency in
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the upper range of low current operation. In Burst Mode operation, lower inductance values will cause the burst frequency to decrease. Inductor Core Selection Once the value for L is known, the type of inductor must be selected. High efficiency converters generally cannot afford the core loss found in low cost powdered iron cores, forcing the use of more expensive ferrite, molypermalloy, or Kool M(R) cores. Actual core loss is independent of core size for a fixed inductor value, but it is very dependent on inductance selected. As inductance increases, core losses go down. Unfortunately, increased inductance requires more turns of wire and therefore copper losses will increase. Ferrite designs have very low core loss and are preferred at high switching frequencies, so design goals can concentrate on copper loss and preventing saturation. Ferrite core material saturates "hard," which means that inductance collapses abruptly when the peak design current is exceeded. This results in an abrupt increase in inductor ripple current and consequent output voltage ripple. Do not allow the core to saturate! Molypermalloy (from Magnetics, Inc.) is a very good, low loss core material for toroids, but it is more expensive than ferrite. A reasonable compromise from the same manufacturer is Kool M. Toroids are very space efficient, especially when you can use several layers of wire. Because they generally lack a bobbin, mounting is more difficult. However, designs for surface mount are available that do not increase the height significantly. Power MOSFET and D1 Selection Two external power MOSFETs must be selected for each controller with the LTC1708: One N-channel MOSFET for each top (main) switch, and one N-channel MOSFET for each bottom (synchronous) switch. The peak-to-peak drive levels are set by the INTVCC voltage. This voltage is typically 5V during start-up (see EXTVCC Pin Connection). Consequently, logic-level threshold MOSFETs must be used in most applications. The only exception is if low input voltage is expected (VIN < 5V);
Kool M is a registered trademark of Magnetics, Inc.
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then, sub-logic level threshold MOSFETs (VGS(TH) < 3V) should be used. Pay close attention to the BVDSS specification for the MOSFETs as well; most of the logic level MOSFETs are limited to 30V or less. Selection criteria for the power MOSFETs include the "ON" resistance RDS(ON), reverse transfer capacitance CRSS, input voltage and maximum output current. When the LTC1708 is operating in continuous mode the duty cycles for the top and bottom MOSFETs are given by: V Main Switch Duty Cycle = OUT VIN V -V Synchronous Switch Duty Cycle = IN OUT VIN The MOSFET power dissipations at maximum output current are given by:
2 V PMAIN = OUT IMAX 1 + RDS(ON) + VIN
( )( )
k VIN
( ) (IMAX )(CRSS )(f)
2
2 V -V PSYNC = IN OUT IMAX 1 + RDS(ON) VIN
( )( )
where is the temperature dependency of RDS(ON) and k is a constant inversely related to the gate drive current. Both MOSFETs have I2R losses while the topside N-channel equation includes an additional term for transition losses, which are highest at high input voltages. For VIN < 20V the high current efficiency generally improves with larger MOSFETs, while for VIN > 20V the transition losses rapidly increase to the point that the use of a higher RDS(ON) device with lower CRSS actually provides higher efficiency. The synchronous MOSFET losses are greatest at high input voltage when the top switch duty factor is low or during a short-circuit when the synchronous switch is on close to 100% of the period. The term (1+) is generally given for a MOSFET in the form of a normalized RDS(ON) vs Temperature curve, but
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= 0.005/C can be used as an approximation for low voltage MOSFETs. CRSS is usually specified in the MOSFET characteristics. The constant k = 1.7 can be used to estimate the contributions of the two terms in the main switch dissipation equation. The Schottky diode D1 shown in Figure 1 conducts during the dead-time between the conduction of the two power MOSFETs. This prevents the body diode of the bottom MOSFET from turning on, storing charge during the deadtime and requiring a reverse recovery period that could cost as much as 3% in efficiency at high VIN. A 1A to 3A Schottky is generally a good compromise for both regions of operation due to the relatively small average current. Larger diodes result in additional transition losses due to their larger junction capacitance. CIN and COUT Selection The selection of CIN is simplified by the multiphase architecture and its impact on the worst-case RMS current drawn through the input network (battery/fuse/capacitor). It can be shown that the worst case RMS current occurs when only one controller is operating. The controller with the highest (VOUT)(IOUT) product needs to be used in the formula below to determine the maximum RMS current requirement. Increasing the output current, drawn from the other out-of-phase controller, will actually decrease the input RMS ripple current from this maximum value (see Figure 4). The out-of-phase technique typically reduces the input capacitor's RMS ripple current by a factor of 30% to 70% when compared to a single phase power supply solution. The type of input capacitor, value and ESR rating have efficiency effects that need to be considered in the selection process. The capacitance value chosen should be sufficient to store adequate charge to keep high peak battery currents down. 20F to 40F is usually sufficient for a 25W output supply operating at 200kHz. The ESR of the capacitor is important for capacitor power dissipation as well as overall battery efficiency. All of the power (RMS ripple current * ESR) not only heats up the capacitor but wastes power from the battery. Medium voltage (20V to 35V) ceramic, tantalum, OS-CON and switcher-rated electrolytic capacitors can be used as
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input capacitors, but each has drawbacks: ceramic voltage coefficients are very high and may have audible piezoelectric effects; tantalums need to be surge-rated; OS-CONs suffer from higher inductance, larger case size and limited surface-mount applicability; electrolytics' higher ESR and dryout possibility require several to be used. Multiphase systems allow the lowest amount of capacitance overall. As little as one 22F or two to three 10F ceramic capacitors are an ideal choice in a 20W to 35W power supply due to their extremely low ESR. Even though the capacitance at 20V is substantially below their rating at zero-bias, very low ESR loss makes ceramics an ideal candidate for highest efficiency battery operated systems. Also consider parallel ceramic and high quality electrolytic capacitors as an effective means of achieving ESR and bulk capacitance goals. In continuous mode, the source current of the top N-channel MOSFET is a square wave of duty cycle VOUT/VIN. To prevent large voltage transients, a low ESR input capacitor sized for the maximum RMS current of one channel must be used. The maximum RMS capacitor current is given by:
CIN Re quiredIRMS IMAX
[V (V
OUT
IN - VOUT
VIN
This formula has a maximum at VIN = 2VOUT, where IRMS = IOUT/2. This simple worst case condition is commonly used for design because even significant deviations do not offer much relief. Note that capacitor manufacturer's ripple current ratings are often based on only 2000 hours of life. This makes it advisable to further derate the capacitor, or to choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design. Always consult the manufacturer if there is any question. The benefit of the LTC1708 multiphase can be calculated by using the equation above for the higher power controller and then calculating the loss that would have resulted if both controller channels switch on at the same time. The total RMS power lost is lower when both controllers are operating due to the interleaving of current pulses through
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the input capacitor's ESR. This is why the input capacitor's requirement calculated above for the worst-case controller is adequate for the dual controller design. Remember that input protection fuse resistance, battery resistance and PC board trace resistance losses are also reduced due to the reduced peak currents in a multiphase system. The overall benefit of a multiphase design will only be fully realized when the source impedance of the power supply/ battery is included in the efficiency testing. The drains of the two top MOSFETS should be placed within 1cm of each other and share a common CIN(s). Separating the drains and CIN may produce undesirable voltage and current resonances at VIN. The selection of COUT is driven by the required effective series resistance (ESR). Typically once the ESR requirement is satisfied the capacitance is adequate for filtering. The output ripple (VOUT) is determined by:
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1 VOUT IL ESR + 8 fCOUT
Where f = operating frequency, COUT = output capacitance, and IL= ripple current in the inductor. The output ripple is highest at maximum input voltage since IL increases with input voltage. With IL = 0.3IOUT(MAX) the output ripple will typically be less than 50mV at max VIN assuming: COUT Recommended ESR < 2 RSENSE and COUT > 1/(8fRSENSE) The first condition relates to the ripple current into the ESR of the output capacitance while the second term guarantees that the output capacitance does not significantly discharge during the operating frequency period due to ripple current. The choice of using smaller output capacitance increases the ripple voltage due to the discharging term but can be compensated for by using capacitors of very low ESR to maintain the ripple voltage at or below 50mV. The ITH pin OPTI-LOOP compensation components can be optimized to provide stable, high performance transient response regardless of the output capacitors selected.
)]
1/ 2
LTC1708-PG
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Manufacturers such as Nichicon, United Chemicon and Sanyo can be considered for high performance throughhole capacitors. The OS-CON semiconductor dielectric capacitor available from Sanyo has the lowest (ESR)(size) product of any aluminum electrolytic at a somewhat higher price. An additional ceramic capacitor in parallel with OS-CON capacitors is recommended to reduce the inductance effects. In surface mount applications multiple capacitors may need to be used in parallel to meet the ESR, RMS current handling and load step requirements of the application. Aluminum electrolytic, dry tantalum and special polymer capacitors are available in surface mount packages. Special polymer surface mount capacitors offer very low ESR but have lower storage capacity per unit volume than other capacitor types. These capacitors offer a very cost-effective output capacitor solution and are an ideal choice when combined with a controller having high loop bandwidth. Tantalum capacitors offer the highest capacitance density and are often used as output capacitors for switching regulators having controlled soft-start. Several excellent surge-tested choices are the AVX TPS, AVX TPSV or the KEMET T510 series of surface mount tantalums, available in case heights ranging from 2mm to 4mm. Aluminum electrolytic capacitors can be used in cost-driven applications providing that consideration is given to ripple current ratings, temperature and long term reliability. A typical application will require several to many aluminum electrolytic capacitors in parallel. A combination of the above mentioned capacitors will often result in maximizing performance and minimizing overall cost. Other capacitor types include Nichicon PL series, NEC Neocap, Pansonic SP and Sprague 595D series. Consult manufacturers for other specific recommendations. INTVCC Regulator An internal P-channel low dropout regulator produces 5V at the INTVCC pin from the VIN supply pin. INTVCC powers the drivers and internal circuitry within the LTC1708. The INTVCC pin regulator can supply a peak current of 50mA and must be bypassed to ground with a minimum of 4.7F tantalum, 10F special polymer, or low ESR type electrolytic capacitor. A 1F ceramic capacitor placed directly adjacent to the INTVCC and PGND IC pins is highly
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recommended. Good bypassing is necessary to supply the high transient currents required by the MOSFET gate drivers and to prevent interaction between channels. Higher input voltage applications in which large MOSFETs are being driven at high frequencies may cause the maximum junction temperature rating for the LTC1708 to be exceeded. The system supply current is normally dominated by the gate charge current. Additional external loading of the INTVCC and 3.3V linear regulators also needs to be taken into account for the power dissipation calculations. The total INTVCC current can be supplied by either the 5V internal linear regulator or by the EXTVCC input pin. When the voltage applied to the EXTVCC pin is less than 4.7V, all of the INTVCC current is supplied by the internal 5V linear regulator. Power dissipation for the IC in this case is highest: (VIN)(IINTVCC), and overall efficiency is lowered. The gate charge current is dependent on operating frequency as discussed in the Efficiency Considerations section. The junction temperature can be estimated by using the equations given in Note 2 of the Electrical Characteristics. For example, the LTC1708 VIN current is limited to less than 24mA from a 24V supply when not using the EXTVCC pin as follows: TJ = 70C + (24mA)(24V)(95C/W) = 125C Use of the EXTVCC input pin reduces the junction temperature to: TJ = 70C + (24mA)(5V)(95C/W) = 81C Dissipation should be calculated to also include any added current drawn from the internal 3.3V linear regulator. To prevent maximum junction temperature from being exceeded, the input supply current must be checked operating in continuous mode at maximum VIN. EXTVCC Connection The LTC1708 contains an internal P-channel MOSFET switch connected between the EXTVCC and INTVCC pins. When the voltage applied to EXTVCC rises above 4.7V, the internal regulator is turned off and the switch closes, connecting the EXTVCC pin to the INTVCC pin thereby supplying internal power. The switch remains closed as long as the voltage applied to EXTVCC remains above 4.5V. This allows the MOSFET driver and control power to be
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derived from the output during normal operation (4.7V < VOUT < 7V) and from the internal regulator when the output is out of regulation (start-up, short-circuit). If more current is required through the EXTVCC switch than is specified, an external Schottky diode can be added between the EXTVCC and INTVCC pins. Do not apply greater than 7V to the EXTVCC pin and ensure that EXTVCC < VIN. Significant efficiency gains can be realized by powering INTVCC from the output, since the VIN current resulting from the driver and control currents will be scaled by a factor of (Duty Cycle)/(Efficiency). For 5V regulators this supply means connecting the EXTVCC pin directly to VOUT. However, for 3.3V and other lower voltage regulators, additional circuitry is required to derive INTVCC power from the output. The following list summarizes the four possible connections for EXTVCC: 1. EXTVCC Left Open (or Grounded). This will cause INTVCC to be powered from the internal 5V regulator resulting in an efficiency penalty of up to 10% at high input voltages. 2. EXTVCC Connected directly to VOUT. This is the normal connection for a 5V regulator and provides the highest efficiency. 3. EXTVCC Connected to an External supply. If an external supply is available in the 5V to 7V range, it may be used to power EXTVCC providing it is compatible with the MOSFET gate drive requirements.
VIN OPTIONAL EXTVCC CONNECTION 5V < VSEC < 7V VIN LTC1708-PG TG1 RSENSE VOUT EXTVCC R6 FCB R5 SGND PGND
1708 F06a
+
CIN VSEC N-CH
VIN CIN
SW
T1 1:N
BG1 N-CH
Figure 6a. Secondary Output Loop & EXTVCC Connection
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4. EXTVCC Connected to an Output-Derived Boost Network. For 3.3V and other low voltage regulators, efficiency gains can still be realized by connecting EXTVCC to an output-derived voltage that has been boosted to greater than 4.7V. This can be done with either the inductive boost winding as shown in Figure 6a or the capacitive charge pump shown in Figure 6b. The charge pump has the advantage of simple magnetics. Topside MOSFET Driver Supply (CB, DB) External bootstrap capacitors CB connected to the BOOST pins supply the gate drive voltages for the topside MOSFETs. Capacitor CB in the functional diagram is charged though external diode DB from INTVCC when the SW pin is low. When one of the topside MOSFETs is to be turned on, the driver places the CB voltage across the gate-source of the desired MOSFET. This enhances the MOSFET and turns on the topside switch. The switch node voltage, SW, rises to VIN and the BOOST pin follows. With the topside MOSFET on, the boost voltage is above the input supply: VBOOST = VIN + VINTVCC. The value of the boost capacitor CB needs to be 100 times that of the total input capacitance of the topside MOSFET(s). The reverse breakdown of the external Schottky diode must be greater than VIN(MAX). When adjusting the gate drive level, the final arbiter is the total input current for the regulator. If a change is made and the input current decreases, then the efficiency has improved. If there is no change in input current, then there is no change in efficiency.
VIN
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1F
+
BAT85 N-CH VN2222LL RSENSE VOUT EXTVCC SW L1 BAT85 0.22F BAT85
+
1F
LTC1708-PG TG1
+
COUT
BG1 N-CH PGND
+
COUT
1708 F06b
Figure 6b. Capacitive Charge Pump for EXTVCC
LTC1708-PG
APPLICATIO S I FOR ATIO
Output Voltage Programming
The LTC1708 output voltages are set by the VID logic inputs for the first controller and by an external feedback resistive divider carefully placed across the output capacitor for the second controller. The resultant feedback signal is compared with the internal precision 0.800V voltage reference by the error amplifier. The output voltage is given by the equation:
R2 VOUT = 0.8 V 1 + R1
The output voltage of the first controller is digitally set to levels between 0.925V and 2.00V using the voltage identification (VID) inputs VID0 to VID4. The internal 5-bit DAC configured as a precision resistive voltage divider sets the output voltage in 50mV or 25mV increments according to Table 1. The VID codes (00000-11110) are engineered to be compatible with Intel Mobile Pentium(R) II and Pentium III processor specifications for output voltages from 0.925V to 2.00V. The LSB (VID0) represents 50mV increments in the upper voltage range (1.30V to 2.00V) and 25mV increments in the lower voltage range (0.925V to 1.275V). The MSB is VID4. When all bits are low, or grounded, the output voltage is 2.00V. Between the ATTNOUT pin and ground is a variable resistor, R1, whose value is controlled by the five input pins (VID0 to VID4). Another resistor, R2, between the ATTNIN and the ATTNOUT pins completes the resistive divider. The output voltage is thus set by the ratio of (R1 + R2) to R1. The LTC1708 has remote sense capability. The top of the internal resistive divider is connected to ATTNIN, and it is referenced to the SGND pin. This allows a Kelvin connection for remotely sensing the output voltage directly across the load, eliminating any PC board trace resistance errors. Each VID digital input is pulled up by a 40k resistor in series with a diode from VIDVCC. Therefore, it must be grounded to get a digital low input, and can be either floated or connected to VIDVCC to get a digital high input. The series diode is used to prevent the digital inputs from
Pentium is a registered trademark of Intel Corporation.
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being damaged or clamped if they are driven higher than VIDVCC. The digital inputs accept CMOS voltage levels. VIDVCC is the supply voltage for the VID section. It is normally connected to INTVCC but can be driven from other sources such as a 3.3V supply. If it is driven from another source, that source MUST be in the range of 2.7V to 5.5V and MUST be alive prior to enabling the LTC1708.
Table 1. VID Output Voltage Programming
VID4 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 VID3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 VID2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 VID1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 VID0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 VOUT (V) 2.000V 1.950V 1.900V 1.850V 1.800V 1.750V 1.700V 1.650V 1.600V 1.550V 1.500V 1.450V 1.400V 1.350V 1.300V * 1.275V 1.250V 1.225V 1.200V 1.175V 1.150V 1.125V 1.100V 1.075V 1.050V 1.025V 1.000V 0.975V 0.950V 0.925V ** Note: *, ** represent codes without a defined output voltage as specified in Intel specifications. The LTC1708 interprets these codes as valid inputs and produces output voltages as follows: [01111] = 1.250V, [11111] = 0.900V.
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SENSE+/SENSE- Pins The common mode input range of the current comparator sense pins is from 0V to (1.1)INTVCC. Continuous linear operation is guaranteed throughout this range allowing output voltage setting from 0.8V to 7.7V, depending upon the voltage applied to EXTVCC. A differential NPN input stage is biased with internal resistors from an internal 2.4V source as shown in the Functional Diagram. This requires that current either be sourced or sunk from the SENSE pins depending on the output voltage. If the output voltage is below 2.4V current will flow out of both SENSE pins to the main output. The output can be easily preloaded by the VOUT resistive divider to compensate for the current comparator's negative input bias current. The maximum current flowing out of each pair of SENSE pins is: ISENSE+ + ISENSE- = (2.4V - VOUT)/24k Since VEAIN is servoed to the 0.8V reference voltage, we can choose R1 in Figure 8 to have a maximum value to absorb this current.
0.8 V R1(MAX ) = 24k 2.4V - VOUT
for VOUT < 2.4V Regulating an output voltage of 1.8V, the maximum value of R1 should be 32K. Note that for an output voltage above 2.4V, R1 has no maximum value necessary to absorb the sense currents; however, R1 is still bounded by the VEAIN feedback current. Soft-Start/Run Function The RUN/SS1 and RUN/SS2 pins are multipurpose pins that provide a soft-start function and a means to shut down the LTC1708. Soft-start reduces the input power source's surge currents by gradually increasing the controller's current limit (proportional to VITH). This pin can also be used for power supply sequencing. An internal 1.2A current source charges up the CSS capacitor. When the voltage on RUN/SS1 (RUN/SS2) reaches 1.5V, the particular controller is permitted to start operating. As the voltage on RUN/SS increases from 1.5V to 3.0V, the internal current limit is increased from 25mV/
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RSENSE to 75mV/RSENSE. The output current limit ramps up slowly, taking an additional 1.25s/F to reach full current. The output current thus ramps up slowly, reducing the starting surge current required from the input power supply. If RUN/SS has been pulled all the way to ground there is a delay before starting of approximately:
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tDELAY =
1.5V CSS = 1.25s / F CSS 1.2A 3V - 1.5V CSS = 1.25s / F CSS 1.2A
(
)
tIRAMP =
(
)
By pulling both RUN/SS pins below 1V and/or pulling the STBYMD pin below 0.2V, the LTC1708 is put into low current shutdown (IQ = 20A). The RUN/SS pins can be driven directly from logic as shown in Figure 7. Diode D1 in Figure 7 reduces the start delay but allows CSS to ramp up slowly providing the soft-start function. Each RUN/SS pin has an internal 6V zener clamp (See Functional Diagram).
VIN 3.3V OR 5V D1 RUN/SS RSS* INTVCC RSS* RUN/SS CSS CSS *OPTIONAL TO DEFEAT OVERCURRENT LATCHOFF (a) (b)
1708 F07
Figure 7. RUN/SS Pin Interfacing
Fault Conditions: Overcurrent Latchoff The RUN/SS pins also provide the ability to latch off the controller(s) when an overcurrent condition is detected. The RUN/SS capacitor, CSS, is used initially to turn on and limit the inrush current. After the controller has been started and been given adequate time to charge up the output capacitor and provide full load current, the RUN/SS capacitor is used for a short-circuit timer. If the regulator's output voltage falls to less than 70% of its nominal value after CSS reaches 4.1V, CSS begins discharging on the assumption that the output is in an overcurrent condition.
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APPLICATIO S I FOR ATIO
If the condition lasts for a long enough period as determined by the size of the CSS and the specified discharge current, the controller will be shut down until the RUN/SS pin voltage is recycled. If the overload occurs during startup, the time can be approximated by: tLO1 [CSS (4.1 - 1.5 + 4.1 - 3.5)]/(1.2A) = 2.7 * 106 (CSS) If the overload occurs after start-up the voltage on CSS will begin discharging from the zener clamp voltage: tLO2 [CSS (6 - 3.5)]/(1.2A) = 2.1 * 106 (CSS) This built-in overcurrent latchoff can be overridden by providing a pull-up resistor to the RUN/SS pin as shown in Figure 7. This resistance shortens the soft-start period and prevents the discharge of the RUN/SS capacitor during an over current condition. Tying this pull-up resistor to VIN as in Figure 7a, defeats overcurrent latchoff. Diode-connecting this pull-up resistor to INTVCC , as in Figure 7b, eliminates any extra supply current during controller shutdown while eliminating the INTV CC loading from preventing controller start-up. Why should you defeat overcurrent latchoff? During the prototyping stage of a design, there may be a problem with noise pickup or poor layout causing the protection circuit to latch off. Defeating this feature will easily allow troubleshooting of the circuit and PC layout. The internal short-circuit and foldback current limiting still remains active, thereby protecting the power supply system from failure. After the design is complete, a decision can be made whether to enable the latchoff feature. The value of the soft-start capacitor CSS may need to be scaled with output voltage, output capacitance and load current characteristics. The minimum soft-start capacitance is given by: CSS > (COUT )(VOUT) (10 - 4) (RSENSE) The minimum recommended soft-start capacitor of CSS = 0.1F will be sufficient for most applications. Fault Conditions: Current Limit and Current Foldback The LTC1708 current comparator has a maximum sense voltage of 75mV resulting in a maximum MOSFET current
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of 75mV/RSENSE. The maximum value of current limit generally occurs with the largest VIN at the highest ambient temperature, conditions that cause the highest power dissipation in the top MOSFET. The LTC1708 includes current foldback to help further limit load current when the output is shorted to ground. The foldback circuit is active even when the overload shutdown latch described above is overridden. If the output falls below 70% of its nominal output level, then the maximum sense voltage is progressively lowered from 75mV to 25mV. Under short-circuit conditions with very low duty cycles, the LTC1708 will begin cycle skipping in order to limit the short-circuit current. In this situation the bottom MOSFET will be dissipating most of the power but less than in normal operation. The short-circuit ripple current is determined by the minimum on-time tON(MIN) of the LTC1708 (less than 200ns), the input voltage and inductor value: IL(SC) = tON(MIN) (VIN/L) The resulting short-circuit current is: ISC = 25mV 1 + IL(SC) RSENSE 2 Fault Conditions: Overvoltage Protection (Crowbar) The overvoltage crowbar is designed to blow a system input fuse when the output voltage of the regulator rises much higher than nominal levels. The crowbar causes huge currents to flow, that blow the fuse to protect against a shorted top MOSFET if the short occurs while the controller is operating. A comparator monitors the output for overvoltage conditions. The comparator (OV) detects overvoltage faults greater than 7.5% above the nominal output voltage. When this condition is sensed, the top MOSFET is turned off and the bottom MOSFET is turned on until the overvoltage condition is cleared. The output of this comparator is only latched by the overvoltage condition itself and will therefore allow a switching regulator system having a poor PC layout to function while the design is being debugged. The bottom MOSFET remains on continuously for as long as the OV condition persists; if VOUT returns to a safe level,
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normal operation automatically resumes. A shorted top MOSFET will result in a high current condition which will open the system fuse. The switching regulator will regulate properly with a leaky top MOSFET by altering the duty cycle to accommodate the leakage. The Standby Mode (STBYMD) Pin Function The Standby Mode (STBYMD) pin provides several choices for start-up and standby operational modes. If the pin is pulled to ground, the RUN/SS pins for both controllers are internally pulled to ground, preventing start-up and thereby providing a single control pin for turning off both controllers at once. If the pin is left open or decoupled with a capacitor to ground, the RUN/SS pins are each internally provided with a starting current enabling external control for turning on each controller independently. If the pin is provided with a current of >3A at a voltage greater than 2V, both internal linear regulators (INTVCC and 3.3V) will be on even when both controllers are shut down. In this mode, the onboard 3.3V and 5V linear regulators can provide power to keep-alive functions such as a keyboard controller. This pin can also be used as a latching "on" and/ or latching "off" power switch if so designed. Frequency of Operation The LTC1708 has an internal voltage controlled oscillator. The frequency of this oscillator can be varied over a 2 to 1 range. The pin is internally self-biased at 1.19V, resulting in a free-running frequency of approximately 220kHz. The FREQSET pin can be grounded to lower this frequency to approximately 140kHz or tied to the INTVCC pin to yield approximately 310kHz. The FREQSET pin may be driven with a voltage from 0 to INTVCC to fix or modulate the oscillator frequency as shown in Figure 5. Minimum On-Time Considerations Minimum on-time tON(MIN) is the smallest time duration that the LTC1708 is capable of turning on the top MOSFET. It is determined by internal timing delays and the gate charge required to turn on the top MOSFET. Low duty cycle applications may approach this minimum on-time limit and care should be taken to ensure that
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tON(MIN) < VOUT VIN( f)
If the duty cycle falls below what can be accommodated by the minimum on-time, the LTC1708 will begin to skip cycles. The output voltage will continue to be regulated, but the ripple voltage and current will increase. The minimum on-time for the LTC1708 is generally less than 200ns. However, as the peak sense voltage decreases the minimum on-time gradually increases up to about 300ns. This is of particular concern in forced continuous applications with low ripple current at light loads. If the duty cycle drops below the minimum on-time limit in this situation, a significant amount of cycle skipping can occur with correspondingly larger current and voltage ripple. FCB Pin Operation The FCB pin can be used to regulate a secondary winding or as a logic level input. Continuous operation is forced when the FCB pin drops below 0.8V. During continuous mode, current flows continuously in the transformer primary. The secondary winding(s) draw current only when the bottom, synchronous switch is on. When primary load currents are low and/or the VIN/VOUT ratio is low, the synchronous switch may not be on for a sufficient amount of time to transfer power from the output capacitor to the secondary load. Forced continuous operation will support secondary windings providing there is sufficient synchronous switch duty factor. Thus, the FCB input pin removes the requirement that power must be drawn from the inductor primary in order to extract power from the auxiliary windings. With the loop in continuous mode, the auxiliary outputs may nominally be loaded without regard to the primary output load. The secondary output voltage VSEC is normally set as shown in Figure 6a by the turns ratio N of the transformer: VSEC (N + 1) VOUT However, if the controller goes into Burst Mode operation and halts switching due to a light primary load current, then VSEC will droop. An external resistive divider from VSEC to the FCB pin sets a minimum voltage VSEC(MIN):
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R6 VSEC(MIN) 0.8 V 1 + R5
If VSEC drops below this level, the FCB voltage forces temporary continuous switching operation until VSEC is again above its minimum. In order to prevent erratic operation if no external connections are made to the FCB pin, the FCB pin has a 0.18A internal current source pulling the pin high. Include this current when choosing resistor values R5 and R6. The following table summarizes the possible states available on the FCB pin:
Table 1
FCB Pin 0V to 0.75V 0.85V < VFCB < 4.3V Condition Forced Continuous (Current Reversal Allowed--Burst Inhibited) Minimum Peak Current Induces Burst Mode Operation No Current Reversal Allowed Regulating a Secondary Winding Burst Mode Operation Disabled Constant Frequency Mode Enabled No Current Reversal Allowed No Minimum Peak Current
Feedback Resistors >4.8V
Voltage Positioning Voltage positioning can be used to minimize peak-to-peak output voltage excursion under worst-case transient loading conditions. The open-loop DC gain of the control loop is reduced depending upon the maximum load step specifications. Voltage positioning can easily be added to the LTC1708 by loading the ITH pin with a resistive divider having a Thevenin equivalent voltage source equal to the midpoint operating voltage of the error amplifier, or 1.2V (see Figure 8). The resistive load reduces the DC loop gain while maintaining the linear control range of the error amplifier. The worst-case peak-to-peak output voltage deviation due to transient loading can theoretically be reduced to half or alternatively the amount of output capacitance can be reduced for a particular application. A complete explanation is included in Design Solutions 10 or the LTC1736 data sheet. (See www.linear-tech.com)
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INTVCC RT2 ITH RT1 RC CC
1708 F08
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VOUT R2 EAIN LTC1708-PG R1
Figure 8. Active Voltage Positioning Applied to the LTC1708
Efficiency Considerations The percent efficiency of a switching regulator is equal to the output power divided by the input power times 100%. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Percent efficiency can be expressed as: %Efficiency = 100% - (L1 + L2 + L3 + ...) where L1, L2, etc. are the individual losses as a percentage of input power. Although all dissipative elements in the circuit produce losses, four main sources usually account for most of the losses in LTC1708 circuits: 1) LTC1708 VIN current (including loading on the 3.3V internal regulator), 2) INTVCC regulator current, 3) I2R losses, 4) Topside MOSFET transition losses. 1. The VIN current has two components: the first is the DC supply current given in the Electrical Characteristics table, which excludes MOSFET driver and control currents; the second is the current drawn from the 3.3V linear regulator output. VIN current typically results in a small (<0.1%) loss. 2. INTVCC current is the sum of the MOSFET driver and control currents. The MOSFET driver current results from switching the gate capacitance of the power MOSFETs. Each time a MOSFET gate is switched from low to high to low again, a packet of charge dQ moves from INTVCC to ground. The resulting dQ/dt is a current out of INTVCC that is typically much larger than the control circuit current. In continuous mode, IGATECHG =f(QT+QB), where QT and QB are the gate charges of the topside and bottom side MOSFETs. Supplying INTVCC power through the EXTVCC switch input from an output-derived source will scale the VIN current
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required for the driver and control circuits by a factor of (Duty Cycle)/(Efficiency). For example, in a 20V to 5V application, 10mA of INTVCC current results in approximately 2.5mA of VIN current. This reduces the mid-current loss from 10% or more (if the driver was powered directly from VIN) to only a few percent. 3. I2R losses are predicted from the DC resistances of the fuse (if used), MOSFET, inductor, current sense resistor, and input and output capacitor ESR. In continuous mode the average output current flows through L and RSENSE, but is "chopped" between the topside MOSFET and the synchronous MOSFET. If the two MOSFETs have approximately the same RDS(ON), then the resistance of one MOSFET can simply be summed with the resistances of L, RSENSE and ESR to obtain I2R losses. For example, if each RDS(ON) = 10m, RL = 5m, RSENSE = 3m and RESR = 10m (sum of both input and output capacitance losses), then the total resistance is 28m. This results in losses ranging from 3% to 8% as the output current increases from 5A to 15A for a 5V output, or an 8% to 20% loss for a 1.6V output. Efficiency varies as the inverse square of VOUT for the same external components and output power level. The combined effects of increasingly lower output voltages and higher currents required by high performance digital systems is not doubling but quadrupling the importance of loss terms in the switching regulator system! 4. Transition losses apply only to the topside MOSFET(s), and become significant only when operating at high input voltages (typically 15V or greater). Transition losses can be estimated from: Transition Loss = (1.7) VIN2 IO(MAX) CRSS f Other "hidden" losses such as copper trace and internal battery resistances can account for an additional 5% to 10% efficiency degradation in portable systems. It is very important to include these "system" level losses during the design phase. The internal battery and fuse resistance losses can be minimized by making sure that CIN has adequate charge storage and very low ESR at the switching frequency. A 25W supply will typically require a minimum of 20F to 40F of capacitance having a
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maximum of 20m to 50m of ESR. The LTC1708 2phase architecture typically halves this input capacitance requirement over competing solutions. Other losses including Schottky conduction losses during dead-time and inductor core losses generally account for less than 2% total additional loss. Checking Transient Response The regulator loop response can be checked by looking at the load current transient response. Switching regulators take several cycles to respond to a step in DC (resistive) load current. When a load step occurs, VOUT shifts by an amount equal to ILOAD (ESR), where ESR is the effective series resistance of COUT. ILOAD also begins to charge or discharge COUT generating the feedback error signal that forces the regulator to adapt to the current change and return VOUT to its steady-state value. During this recovery time VOUT can be monitored for excessive overshoot or ringing, which would indicate a stability problem. OPTILOOP compensation allows the transient response to be optimized over a wide range of output capacitance and ESR values. The availability of the ITH pin not only allows optimization of control loop behavior but also provides a DC coupled and AC filtered closed loop response test point. The DC step, rise time and settling at this test point truly reflects the closed loop response. Assuming a predominantly second order system, phase margin and/or damping factor can be estimated using the percentage of overshoot seen at this pin. The bandwidth can also be estimated by examining the rise time at the pin. The ITH external components shown in the Figure 1 circuit will provide an adequate starting point for most applications. The ITH series RC-CC filter sets the dominant pole-zero loop compensation. The values can be modified slightly (from 0.5 to 2 times their suggested values) to optimize transient response once the final PC layout is done and the particular output capacitor type and value have been determined. The output capacitors need to be selected because the various types and values determine the loop gain and phase. An output current pulse of 20% to 100% of full-load current having a rise time of 1s to 10s will produce output voltage and ITH pin waveforms that will
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give a sense of the overall loop stability without breaking the feedback loop. The initial output voltage step resulting from the step change in output current may not be within the bandwidth of the feedback loop, so this signal cannot be used to determine phase margin. This is why it is better to look at the ITH pin signal which is in the feedback loop and is the filtered and compensated control loop response. The gain of the loop will be increased by increasing RC and the bandwidth of the loop will be increased by decreasing CC. If RC is increased by the same factor that CC is decreased, the zero frequency will be kept the same, thereby keeping the phase the same in the most critical frequency range of the feedback loop. The output voltage settling behavior is related to the stability of the closedloop system and will demonstrate the actual overall supply performance. A second, more severe transient is caused by switching in loads with large (>1F) supply bypass capacitors. The discharged bypass capacitors are effectively put in parallel with COUT, causing a rapid drop in VOUT. No regulator can alter its delivery of current quickly enough to prevent this sudden step change in output voltage if the load switch resistance is low and it is driven quickly. If the ratio of CLOAD to COUT is greater than1:50, the switch rise time should be controlled so that the load rise time is limited to approximately 25 * CLOAD. Thus a 10F capacitor would require a 250s rise time, limiting the charging current to about 200mA.
A IPK RATING
T VOLTAGE OR NSTRUMENT
Figure 9. Automotive Application Protection
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Automotive Considerations: Plugging into the Cigarette Lighter As battery-powered devices go mobile, there is a natural interest in plugging into the cigarette lighter in order to conserve or even recharge battery packs during operation. But before you connect, be advised: you are plugging into the supply from hell. The main power line in an automobile is the source of a number of nasty potential transients, including load-dump, reverse-battery and double-battery. Load-dump is the result of a loose battery cable. When the cable breaks connection, the field collapse in the alternator can cause a positive spike as high as 60V which takes several hundred milliseconds to decay. Reverse-battery is just what it says, while double-battery is a consequence of tow-truck operators finding that a 24V jump start cranks cold engines faster than 12V. The network shown in Figure 9 is the most straight forward approach to protect a DC/DC converter from the ravages of an automotive power line. The series diode prevents current from flowing during reverse-battery, while the transient suppressor clamps the input voltage during load-dump. Note that the transient suppressor should not conduct during double-battery operation, but must still clamp the input voltage below breakdown of the converter. Although the LTC1708 has a maximum input voltage of 36V, most applications will be limited to 30V by the MOSFET BVDSS.
VIN LTC1708-PG
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Design Example As a design example for one channel, assume VIN = 12V(nominal), VIN = 22V(max), VOUT = 1.6V, IMAX = 14A, and f = 300kHz, RSENSE can immediately be calculated: RSENSE = 50mV/14A 0.0035 0.003 Tie the FREQSET pin to the INTVCC pin for 300kHz operation, or use a resistive divider from INTVCC according to Figure 5 to reduce the operating frequency. Assume a 1H inductor and check the actual value of the ripple current. The following equation is used:
V V IL = OUT 1 - OUT ( f)(L) VIN
The highest value of the ripple current occurs at the maximum input voltage:
1.6 V 1.6 V IL = 1- = 4.95A 300kHz(1H) 22V
The ripple current is 35% of maximum output current. Increasing the ripple current will also help ensure that the minimum on-time of 200ns is not violated. The minimum on-time occurs at maximum VIN:
ISC =
tON(MIN) =
VOUT VIN(MAX)f
=
1.6 V = 242ns 22V(300kHz)
Since the output voltage is below 2.4V the output resistive divider will need to be sized to not only set the output voltage but also to absorb the SENSE pins current.
0.8 V R1(MAX) = 24k 2.4V - VOUT 0.8 V = 24K = 24k 2.4V - 1.6 V
Choosing 1% resistors; R1 = R2 = 20k yields an output voltage of 1.600V. If the VID section of the LTC1708-PG is used, R1 will range from a value of 6.6k to 64k. If the forced
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continuous mode is not selected and the programmed voltage is less than 1.4V with no external load, it is necessary to preload the output in order to prevent the current comparator input bias current from causing the output voltage to rise above the designed level. A 16k preload resistor will prevent this from happening for all programmed output voltages down to the minimum 0.925V level. The power dissipation on the topside MOSFET can be easily estimated. Choosing a International Rectifier IRF7811 results in; RDS(ON) = 0.011, CRSS = 240pF. At maximum input voltage with T(estimated) = 50C:
PMAIN = = 1.0W
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( ) [1+ (0.005)(50C - 25C)] 2 (0.011) + 1.7(22V) (14A)(240pF)(300kHz)
1.6 V 14 22V
2
A short-circuit to ground will result in a folded back current of:
25mV 1 200ns(22V) + = 12.7 A 0.003 2 1H
with a typical value of RDS(ON) and = (0.005/C)(20) = 0.1. The resulting power dissipated in the bottom MOSFET is: PSYNC = 22V - 1.6 V 12.7 A 22V = 1.23W
(
) (1.1)(0.0075)
2
which is similar to full-load conditions. CIN is chosen for an RMS current rating of at least 5A at temperature assuming only this channel is on. COUT is chosen with an ESR of 0.01 for low output ripple. The output ripple in continuous mode will be highest at the maximum input voltage. The output voltage ripple due to ESR is approximately: VORIPPLE = RESR(IL) = 0.01(4.95A) = 50mVP-P
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PC Board Layout Checklist
When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the LTC1708. These items are also illustrated graphically in the layout diagram of Figure 10. The Figure 11 illustrates the current waveforms present in the various branches of the 2-phase synchronous regulators operating in the continuous mode. Check the following in your layout: 1. Are the top N-channel MOSFETs M1 and M3 located within 1cm of each other with a common drain connection
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18
RUN/SS1 SENSE1 + SENSE1 - EAIN1 FREQSET STBYMD FCB ITH1 SGND
PGOOD TG1 SW1 BOOST1 VIN BG1 EXTVCC INTVCC PGND
INTVCC
INTVCC
28 VIN
LTC1708-PG 27 BG2 3.3VOUT ITH2 EAIN2 SENSE2 - SENSE2 + ATTNOUT ATTNIN VID0 VID1 BOOST2 SW2 TG2 RUN/SS2 VIDVCC VID4 VID3 VID2 26 25 24 23 22 21 20 19 VID CONTROL INPUTS
+
Figure 10. LTC1708 Recommended Printed Circuit Layout Diagram
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at CIN? Do not attempt to split the input decoupling for the two channels as it can cause a large resonant loop. 2. Are the signal and power grounds kept separate? The combined LTC1708 signal ground pin and the ground return of CINTVCC must return to the combined COUT (-) terminals. The path formed by the top N-channel MOSFET, Schottky diode and the CIN capacitor should have short leads and PC trace lengths. The output capacitor (-) terminals should be connected as close as possible to the (-) terminals of the input capacitor by placing the
POWER GOOD 36 35 34 33 32 31 INTVCC VOUT1
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30 29
1708 F10
+
VOUT2
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capacitors next to each other and away from the Schottky loop described above. 3. Do the LTC1708 feedback resistive dividers connect to the (+) terminals of COUT? The resistive divider must be connected between the (+) terminal of COUT and signal ground. The R2 (Figure 8) connection should not be along the high current input feeds from the input capacitor(s). 4. Are the SENSE - and SENSE + leads routed together with minimum PC trace spacing? The filter capacitor between SENSE + and SENSE - should be as close as possible to the IC. Ensure accurate current sensing with Kelvin connections.
SW1
VIN RIN
CIN
+
SW2
BOLD LINES INDICATE HIGH, SWITCHING CURRENT LINES. KEEP LINES TO A MINIMUM LENGTH.
Figure 11. Branch Current Waveforms
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5. Is the INTVCC decoupling capacitor connected close to the IC, between the INTVCC and the power ground pins? This capacitor carries the MOSFET drivers current peaks. An additional 1F ceramic capacitor placed immediately next to the INTVCC and PGND pins can help improve noise performance substantially. 6. Keep the switching nodes (SW1, SW2), top gate nodes (TG1, TG2), and boost nodes (BOOST1, BOOST2) away from sensitive small-signal nodes, especially from the opposites channel's voltage and current sensing feedback pins. All of these nodes have very large and fast moving signals and therefore should be kept on the "output side" of the LTC1708 and occupy minimum PC trace area.
L1 RSENSE1 VOUT1 D1 COUT1
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RL1
L2
RSENSE2
VOUT2
D2
COUT2
+
RL2
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LTC1708-PG
APPLICATIO S I FOR ATIO
7. Use a modified "star ground" technique: a low impedance, large copper area central grounding point on the same side of the PC board as the input and output capacitors with tie-ins for the bottom of the INTVCC decoupling capacitor, the bottom of the voltage feedback resistive divider and the SGND pin of the IC. PC Board Layout Debugging Start with one controller on at a time. It is helpful to use a DC-50MHz current probe to monitor the current in the inductor while testing the circuit. Monitor the output switching node (SW pin) to synchronize the oscilloscope to the internal oscillator and probe the actual output voltage as well. Check for proper performance over the operating voltage and current range expected in the application. The frequency of operation should be maintained over the input voltage range down to dropout and until the output load drops below the low current operation threshold--typically 10% to 20% of the maximum designed current level in Burst Mode operation. The duty cycle percentage should be maintained from cycle to cycle in a well-designed, low noise PCB implementation. Variation in the duty cycle at a subharmonic rate can suggest noise pickup at the current or voltage sensing inputs or inadequate loop compensation. Overcompensation of the loop can be used to tame a poor PC layout if regulator bandwidth optimization is not required. Only after each controller is checked for their individual performance should both controllers be turned on at the same time. A particularly difficult region of operation is when one controller channel is nearing its current comparator trip point when the other channel is turning on its top MOSFET. This occurs around 50% duty cycle on either channel due to the phasing of the internal clocks and may cause minor duty cycle jitter.
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Short-circuit testing can be performed to verify proper overcurrent latchoff, or 5A can be provided to the RUN/ SS pin(s) by resistors from VIN to prevent the short-circuit latchoff from occurring. Reduce VIN from its nominal level to verify operation of the regulator in dropout. Check the operation of the undervoltage lockout circuit by further lowering VIN while monitoring the outputs to verify operation. Investigate whether any problems exist only at higher output currents or only at higher input voltages. If problems coincide with high input voltages and low output currents, look for capacitive coupling between the BOOST, SW, TG, and possibly BG connections and the sensitive voltage and current pins. The capacitor placed across the current sensing pins needs to be placed immediately adjacent to the pins of the IC. This capacitor helps to minimize the effects of differential noise injection due to high frequency capacitive coupling. If problems are encountered with high current output loading at lower input voltages, look for inductive coupling between CIN, Schottky and the top MOSFET components to the sensitive current and voltage sensing traces. In addition, investigate common ground path voltage pickup between these components and the SGND pin of the IC. An embarrassing problem, which can be missed in an otherwise properly working switching regulator, results when the current sensing leads are hooked up backwards. The output voltage under this improper hookup will still be maintained but the advantages of current mode control will not be realized. Compensation of the voltage loop will be much more sensitive to component selection. This behavior can be investigated by temporarily shorting out the current sensing resistor--don't worry, the regulator will still maintain control of the output voltage.
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LTC1708-PG
TYPICAL APPLICATIO
0.1F 1 2 180pF 20k 1% 4.3k 17.5k 1% 3 1000pF 4 5 1M 6 7 RUN/SS1 SENSE1 + SENSE1 - EAIN1 FREQSET STBYMD FCB PGOOD TG1 SW1 BOOST1 VIN BG1 36 35
10k 0.01F INTVCC 15k 33pF 100pF 330pF 33k 68k 160k INTVCC
VIN
1000pF
CMDSH-3TR 30 5V EXTVCC (OPTIONAL) 0.1F LTC1708-PG 29 8 INTVCC ITH1 1F 4.7F 28 9 10V SGND PGND CMDSH-3TR 27 10 3.3VOUT BG2
+
11 12 13 1000pF 14 15 1000pF 16 17 18
ITH2 EAIN2 SENSE2 - SENSE2 + ATTNOUT ATTNIN VID0 VID1
0.1F
VIN: 12V TO 22V VOUT1: 1.5V/2.5A VOUT2: 0.925V TO 2V/14A SWITCHING FREQUENCY: 250kHz
M1a, M1b: FDS6982 M2: IRF7811 M3: IRF7809
Figure 12. LTC1708 High Efficiency, Constant Frequency CPU Core/IO Power Supply with Active Voltage Positioning
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100k POWER GOOD INTVCC L1 2.2H 0.015 34 33 32 31 VIN 7.5V TO 24V 180F 4V PANASONIC SP 0.1F M1a M1b D1 MBRM140T3 TIGHTLY COUPLE THESE CURRENT SENSING FEEDBACK PATHS VOUT1 1.5V/2.5A PEAK
+
10
+ +
10F 35V x3
270F 2V PANASONIC SP x4 10F 6.3V CER
+ +
BOOST2 SW2 TG2 RUN/SS2 VIDVCC VID4 VID3 VID2
26 25 24 23 22 21 20 19 VID CONTROL INPUTS 0.47F
M2
M3 D2 MBRM340T3 0.003 L2 1H
VOUT2 0.925V TO 2V 14A TIGHTLY COUPLE THESE CURRENT SENSING FEEDBACK PATHS
INTVCC
1708 F12
L1: 2.2H L2: 1H
NOTE: ELECTRICAL PATHS DRAWN WITH THICK LINES SHOULD BE KEPT AS SHORT AND WIDE AS POSSIBLE. THESE PATHS WILL RADIATE EMI AT THE SWITCHING FREQUENCY. KEEP THE PATHS' ENCLOSED AREA SMALL.
LTC1708-PG
PACKAGE DESCRIPTIO
5.20 - 5.38** (0.205 - 0.212)
0.13 - 0.22 (0.005 - 0.009)
0.55 - 0.95 (0.022 - 0.037)
NOTE: DIMENSIONS ARE IN MILLIMETERS *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.152mm (0.006") PER SIDE **DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD FLASH SHALL NOT EXCEED 0.254mm (0.010") PER SIDE
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Dimensions in inches (millimeters) unless otherwise noted.
G Package 36-Lead Plastic SSOP (0.209)
(LTC DWG # 05-08-1640)
12.67 - 12.93* (0.499 - 0.509) 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19
7.65 - 7.90 (0.301 - 0.311)
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 1.73 - 1.99 (0.068 - 0.078)
0 - 8
0.65 (0.0256) BSC
0.25 - 0.38 (0.010 - 0.015)
0.05 - 0.21 (0.002 - 0.008)
G36 SSOP 1098
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LTC1708-PG RELATED PARTS
PART NUMBER LTC1159 LTC1430 LTC1436A-PLL LTC1438/LTC1439 LTC1438-ADJ LTC1538-AUX LTC1539 LTC1625/LTC1775 LTC1628 LTC1629 LTC1702 LTC1703 LTC1709 LTC1735 LTC1736 LTC1929 DESCRIPTION High Efficiency Synchronous Step-Down Switching Regulator Controller High Power Step-Down Synchronous DC/DC Controller in SO-8 High Efficiency Low Noise Synchronous Step-Down Switching Regulator Dual High Efficiency Low Noise Synchronous Step-Down Switching Regulators Dual Synchronous Controller with Auxiliary Regulator Dual High Efficiency Low Noise Synchronous Step-Down Switching Regulator Dual High Efficiency Low Noise Synchronous Step-Down Switching Regulator No RSENSE Current Mode Synchronous Step-Down Controller Dual Output, 2-Phase Step-Down Synchronous Current Mode Controller 20A to 200A PolyPhaseTM Synchronous Current Mode Controller No RSENSE 2-Phase Dual Synchronous Step-Down Controller No RSENSE 2-Phase Dual Synchronous Step-Down Controller with 5-Bit Mobile VID Control 42A High Efficiency Synchronous Current Mode Controller with 5-Bit Desktop VID Control High Efficiency Synchronous Current Mode Controller with 5-Bit Mobile VID Control Single Output, 2-Phase Synchronous Current Mode Controller
TM
COMMENTS 100% DC, Logic Level MOSFETs, VIN < 40V High Efficiency 5V to 3.3V Conversion at Up to 15A Adaptive PowerTM Mode 20-Pin, 24-Pin SSOP POR, Auxiliary Regulator POR, External Feedback Divider Auxiliary Regulator, 5V Standby 5V Standby, POR, Low-Battery, Aux Regulator 97% Efficiency, No Sense Resistor, 16-Pin SSOP Optimized Solution Cost, 3.5V VIN 36V Expandable from 2-Phase to 12-Phase, Uses All Surface Mount Components, No Heat Sink 550kHz, No Sense Resistor, VIN 7V Mobile Pentium III Processors, 550kHz, VIN 7V Server, Workstation All Surface Mount Solution
High Efficiency Synchronous Step-Down Synchronous Current Mode Controller Output Fault Protection, 16-Pin SSOP Output Fault Protection, 24-Pin SSOP, Power Good 3.5V VIN 36V Up to 42A, Uses All Surface Mount Components, No Heat Sink
Adaptive Power, No RSENSE and PolyPhase are trademarks of Linear Technology Corporation.
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408)432-1900 q FAX: (408) 434-0507 q www.linear-tech.com
1708i LT/TP 0200 4k * PRINTED IN USA
(c) LINEAR TECHNOLOGY CORPORATION 2000

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